Curve Tracing Capability. • Six Separate V/I Supplies. • Latch-Up Testing with 64k /pin. ESD and Latch-up Test Services. MM (30V – 2kV). • EIA/JESDAC. JESDA is a reference document; it is not a requirement per JESD47 ( Stress Test Driven Qualification of Integrated Circuits). Machine. AEDR and AEDR Reflective Surface Mount Optical Encoder Reliability Data Sheet Description Failure Rate Prediction The following.
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ELECTROSTATIC DISCHARGE (ESD) SENSITIVITY TESTING MACHINE MODEL (MM) | JEDEC
Show 5 results per page. One of many examples is a device sliding down a shipping tube hitting a metal surface. Jesf22 – April 27, This document was written with the intent to provide information for quality organizations in both semiconductor companies and their customers to assess and make decisions on safe ESD CDM level requirements. Solid State Memories JC This particular distribution is commonly used in describing useful life failures.
It will be shown through this document why realistic modifying of the ESD target levels for component level ESD is not only essential but is also urgent. In June the formulating committee approved the addition of jes22 ESDA logo on the covers of this document. The relationship between ambient given by the following: Please see Annex C for revision history. Filter by document type: CDM ESD events not only reduce assembly yields but can also produce device damage that goes undetected by factory test and later is the cause of a latent failure.
Part I will primarily address hard failures characterized by physical damage to a system failure category d as classified by IEC Avago tests parts at the absolute maximum rated conditions recommended for the device. In the case of zero failures, one failure is assumed for this calculation. Discharges to devices on unterminated circuit assemblies are also well-modeled by the CDM test.
Failures are catastrophic or parametric. The document is organized in different sections to give as many technical details as possible to support the purpose given in the abstract.
Section 2 “ESD (Electrostatic Discharge) testing”
This report is the first part of a two part document. Multiple Chip Packages JC This document was written with the intent to provide information for quality organizations in both semiconductor companies and their customers to assess and make decisions on safe ESD level requirements.
Over the last several decades the so called “machine model” aka MM and its application to the required ESD component qualification has been grossly misunderstood. This new test method describes a uniform method for establishing charged-device model electrostatic discharge withstand thresholds.
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Catastrophic failures are open, short, no logic output, no dynamic parameters while parametric failures are failures to meet an electrical characteristic as specified in product catalog such as output voltage, duty or 1a15 errors. Displaying 1 – 7 of 7 documents. The assumed distribution of failures is exponential.
The published document should be used as a reference to propagate this message throughout the industry. Reaffirmed May JEP Oct This document was written with the intent to provide information for quality organizations in both semiconductor companies and their customers to assess and jesd22 decisions on safe ESD CDM level requirements.
The scope of this JEDEC document is to present evidence to discontinue use of this particular model stress test without incurring any reduction in the IC component’s ESD reliability for manufacturing. In this regard, the document’s purpose is to provide the necessary technical arguments for strongly recommending no further use of this model for IC qualification.
Data subject to change. This standard establishes the procedure for testing, evaluating, and classifying components and microcircuits according to their susceptibility sensitivity to damage or degradation by exposure to a defined human body model HBM electrostatic discharge ESD. This confidence interval is based on the statistics of the distribution of failures.
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