IPC 9701 PDF

IPC Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments. IPC CD: PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS. Reliability of FPGA Assemblies. Pb/Sn & Pb-free Solders. Tested per IPC A by. Reza Ghaffarian, Ph.D. NASA-Jet Propulsion Laboratory, Caltech.

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Revision A includes Appendix B which provides recommended changes to the thermal cycling profiles given in the document when utilizing Ilc solder joints. Training Media Permissible Uses.

Solder Joint Reliability

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Thermal Cycling is the most common method of testing Solder Joint Reliability. Common test specifications include:. Whether you are trying to implement a new solder type or new component types, solder joint reliability testing is essential in providing confidence that your product will perform within its intended operating limits.


When used with IPC-SM, it provides an understanding of the physics of SMT solder joint failure and an approximate means of relating performance tests results to the reliability of solder attachments in their use environments.

Establishes levels of performance and reliability of the solder attachments of surface mount devices to rigid, flexible and rigid-flex circuit structures. Common test specifications include: The electrical resistance is continuously monitored kpc testing using data loggers.

We will continue to accept orders via e-mail and web during our office closure. Representative temperature profile for thermal cycle test conditions.

Thermal Cycling is usually performed at a transition rate of less than or equal to 20C per minute usually 10 to 14C per minute to avoid thermal shock with cycles per hour. This provides you with useful technical information for future designs, saving you time and money.

Solder Joint Reliability | NTS

Provides specific test methods to evaluate the performance and reliability of surface 9710 solder attachments of electronic assemblies. To view this site, you must enable JavaScript or upgrade to a JavaScript-capable browser.


The results from different test programs can be compared to provide an understanding of design requirements for adequate reliability. Please allow 2 business days for us to review and process your order.

Per IPC, temperature extremes are based on the product category with the low temperature usually 25C below the glass transition temperature Tg of the printed circuit board material. See More See Less.