Telcordia software to calculate the reliability prediction of electronic equipment based on the Telcordia (Bellcore) TR and SR standards. Free trial. Telcordia Telecom Information SuperStore – Reliability Prediction Procedure for The following documents were fully or partly replaced by SR TR Bellcore TR – Download as PDF File .pdf), Text File .txt) or read online.

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Bellcore/Telcordia Reliability Prediction in Lambda Predict

The models allow reliability prediction to be performed using three methods for predicting product reliability:. So the result of 0. This is because the empirical and physics of failure methods bsllcore the system failure rate based on the predictions for the components e.

However, if you think your products do not exhibit a constant failure rate and therefore cannot be described by an exponential distribution, the life characteristic usually will not be the MTBF.

Telcordia Electronic Reliability Prediction Software to TR and SR Standards

Since the parts may not operate under the reference conditions, the real operating conditions will result in failure rates that are different from those given by the “parts count” method. One of the earliest and most successful acceleration models predicts how the time-to-failure of a system varies with temperature.

Time plot and calculated B10 life. These predictions provide necessary input to system-level reliability nellcore for predicting expected downtime per year and system availability. This procedure also documents a recommended method for predicting serial system hardware reliability.

Figure 5 shows the reliability plot and the estimated B10 life at the usage temperature level. It can also be used for: For example, if the fan is broken in your laptop, the CPU will fail faster because of the high temperature. The activation energy is usually related to certain fr-332 mechanisms and failure modes, and can be determined by correlating thermal cycling test data and the Coffin-Manson model.

The system’s failure rate is equal to the sum of the failure ttr-332 of the components involved. These standards use a series of models for various categories of electronic, electrical and electro-mechanical components to predict steady-state failure rates which environmental conditions, quality levels, electrical stress ttr-332 and various other parameters affect.


Hot carrier injection describes the phenomena observed in MOSFETs by which the carrier gains sufficient energy to be injected into the gate oxide, generate interface or bulk oxide defects and degrade MOSFETs characteristics such as threshold voltage, transconductance, etc. While the Arrhenius model emphasizes the dependency of reactions on temperature, the Eyring model is commonly used for demonstrating the dependency of reactions on stress factors other than temperature, such as mechanical stress, humidity or voltage.

The advantages and disadvantages bellcoore empirical methods have been discussed a lot in the past three decades. Because of dissatisfaction with military handbook methods for their commercial products, Bellcore designed its bellcoer reliability prediction standard for commercial telecommunication products.

Notice 1 and Notice 2 Issue 4 of SR provides the only hardware reliability prediction procedure developed from the input and participation of a cross-section of major industrial companies. An extended range of complexity for devices, and the addition of new devices. The most common failure mode is “conductor open. bfllcore

FAQ: What is Telcordia (Bellcore) SR?

Reliability prediction is an important element in the process of designing or selecting equipment. The component is tested under temperatures ofand Kelvin. These methods tend to present good estimates of reliability for similar or slightly modified parts. Time plot and calculated B10 life for the analysis.

Users can construct hierarchical breakdowns of systems with no restrictions on block numbers or levels of indenture. Notice 1 in and Notice 2 in In today’s competitive electronic products market, having higher reliability than competitors is one of the key factors for success. Historically, this term has been used to denote the process of applying mathematical models and component data for the purpose of estimating the field reliability of a system before failure data are available for the system.

The current density J and temperature T are factors in the design process that affect electromigration. Electronic devices with aluminum or aluminum alloy with small percentages of copper and silicon metallization are subject to corrosion failures and therefore bellclre be described with the following model [11]:.

Times-to-failure are recorded and then analyzed with an appropriate statistical distribution in order to estimate reliability metrics such as the B10 life. Bellcore capacitor failure rate example. Powerful global editing facilities trr-332 available for performing “what if” evaluations. The empirical or standards based methods can be used in the design stage to quickly obtain a rough estimation of product reliability.


Electromigration is a failure mechanism that results from the transfer of momentum from the electrons, which move in the applied electric field, to the ions, which make up the lattice of the interconnect material.

It can also be used for:. Therefore, the prediction is usually more accurate, given that enough samples are used in the testing. The models allow reliability prediction to be performed using three methods for predicting product reliability: Three factors are usually considered for testing: The models allow reliability prediction to be performed using three methods for predicting product reliability:.

In Method III, the predicted failure rate is a weighted average of the generic steady-state failure rate and the field failure rate. First, we will discuss empirical prediction methods, which are based on the experiences of engineers and on historical data. If the parameters cannot be determined without conducting a test, the failure data obtained from the test can be used to get the model parameters.

This leads to the concept of reliability prediction. Features Powerful and user friendly Telcordia telecom standard reliability prediction software Combine prediction methods for complex analysis Optimize designs to meet targeted goals Select components with regard to reliability and cost savings Be more accurate and efficient than with manual methods Take bellfore of powerful ‘what if’ analytical tools Identify weak areas in a system bellxore Build and open multiple systems and projects files Drag and drop components and systems between projects Powerful charting facilities.

Time plot and the calculated B10 life for the analysis. On Reliabilityvol. Among these approaches, three main categories are often used within government and industry: This model takes the form [9]:. Sitemap Legal Privacy Contact Us. These techniques estimate the mean failure rate in FITs for electronic equipment. Issue 4 of SR provides all the tools needed for predicting device and unit hardware reliability, and contains important revisions since the document was last issued.

The Telcordia standard also documents a recommended method for predicting serial system hardware reliability. In using the above models, the model parameters can be determined from the design specifications or operating conditions.